A practical DFM checklist before you send boards to assembly
Pad design, test access, and panelization choices that save weeks on the line.
Fiducials and tooling holes should be consistent with your panel drawing; asymmetric marks reduce wrong orientation risk.
Thermal relief on copper pours affects reflow uniformity—especially on heavy connectors.
Reserve test points for ICT or flying-probe access where coverage matters, and confirm BGA sites allow X-ray inspection without shadowing critical joints.
Sharing this early with your assembler prevents avoidable stencil redesigns and first-article delays.